ISSCC 2020: 15 articles from the Mainland including 8 articles from Hong Kong and Macau
On November 22, 2019, the China IC Design Industry Annual Meeting 2019 and the Nanjing IC Industry Innovation Development Summit Forum were held at the Nanjing International Convention and Exhibition Center. During this annual meeting, the organizer cooperated with the Far East Technical Committee of the International Solid-State Circuits Conference (ISSCC) to hold a 2020 ISSCC press conference in China. The purpose of this report is to introduce scholars and practitioners in related fields in China to the latest ISSCC paper collection and the outstanding performance of Chinese academic industry in publishing ISSCC 2020 papers.
In February 2020, the 67th ISSCC will be held in San Francisco, USA. ISSCC was first held in 1953, and has enjoyed the reputation of “Chip Olympics” for decades, representing the highest international academic level in the chip field. A total of 23 papers were collected from academic and industrial institutions in China (including Hong Kong and Macau) at this session. These include 15 papers from Mainland China, 6 papers from Macau, and 2 papers from Hong Kong. The total number of articles as the first author and the first research institution ranks second in the Far East. This number exceeds Taiwan, Japan and Singapore, second only to the United States and South Korea in the world.
This year ISSCC has added the latest chip release compared to the past. In addition, in the keynote speech, including the machine learning from Google, MediaTek's AIoT, IMEC's heterogeneous computing, and IBM's quantum technology will be on display, representing ISSCC. Concerns about future technology trends.
Looking at the distribution of papers in China, Hong Kong, and Macao, the 15 papers collected in Mainland China came from: Tsinghua University (5), University of Electronic Science and Technology (3), Peking University (1), Southeast University (1), Xi'an Jiaotong University (1 paper), Tianjin University (1 paper), Fudan University (1 paper), Shanghai Jiaotong University (1 paper), and Chongqing Xianyi Electronic Technology Company (1 paper); all 6 papers accepted in Macau From the University of Macau; the Hong Kong University of Science and Technology and the Hong Kong Applied Science and Technology Research Institute respectively contributed all 2 papers in Hong Kong. Among them, the papers of Xi'an Jiaotong University, Tianjin University, Chongqing Yiyi Electronic Technology and Hong Kong Applied Science and Technology Research Institute have all been included for the first time, representing the steady rise of China's integrated circuit technology.
At the same time, the entire Far East region has once again passed for five years, surpassing North America, and becoming the largest paper submission area. This also means that chip technology is moving to the Far East region again.
ISSCC 2020 China papers come from 11 different institutions, covering a total of 9 technical fields, including: analog design (1 paper), power management (2 papers), wireless communication (3 papers), data converters (5 papers) , Forward-looking technology (2 articles), RF technology (4 articles), digital circuits (2 articles), images, MEMS, (1 article), and machine learning and artificial intelligence (3 articles). From the above data, it can be seen that in addition to the significant increase in the number of papers and publishing institutions compared to 2019 (18 papers from 8 institutions), the coverage of the technology field has also expanded. It is worth noting that a number of colleges and industrial institutions have been accepted for the first time, achieving a key breakthrough from 0 to 1. This achievement reflects China's current development momentum of integrated circuit design and integrated development in the field of integrated circuit design. It also proves that China's international recognition and influence in this field are constantly increasing.
If you consider the entire Far East, the areas where Asian papers have the absolute advantage include imaging, machine learning, storage, special processors, and so on.
ISSCC 2020 added a new highlight in the preparation of the technical organizing committee, and "Machine Learning and Artificial Intelligence" set up an independent technical group. In addition, in the 14th report of the conference, "Low Power Machine Learning", all three papers came from the mainland of China, which fully demonstrated that China has reached the world-leading level in the academic field of AI chip design.
In addition, there are concentrated outbreaks in popular technology fields such as ToF and brain science, which also confirms the prospects of these technologies.
Editor-in-chief: Zhang Xinyi