semiconductor

Forum on Integrated Innovation and Development of Integrated Circuits Advanced Packaging Industry Chain Held

来源:中国电子报、电子信息产业网 发布时间:2019-11-22 16:20 我要评论 Author: Source: China Electronics News, the electronic information industry network Date: 2019-11-22 16:20 I want to comment

On November 22, 2019, the National Integrated Circuits Packaging and Testing Industry Chain Technology Innovation Strategic Alliance held the "Integrated Circuits Integrated Packaging Industry Chain Collaborative Innovation Development Forum" at the Pullman Hotel in Wuxi New Lake to celebrate the national integrated circuit packaging and testing industry chain technology innovation The tenth anniversary of the establishment of the strategic alliance. Qiu Gang, deputy inspector of the Ministry of Science and Technology's Major Special Projects Division, deputy director of the 02 Major Project Implementation Management Office, deputy director of the National Integrated Circuit Industry Development Advisory Committee, leader of the National Science and Technology Major Supervision and Evaluation Team in the field of electronic information, and former director of the Foreign Experts Bureau Ma Junru Li Xinnan, Secretary General of the Liaison Group of the National Ministry of Science and Technology, Chairman of the Industrial Technology Innovation Strategic Alliance Cooperative Development Network, Director of the 02 Special Office, Deputy Director of the Shanghai Science and Technology Commission, Gan Frequency, and Deputy Mayor Zhu Aixun of Wuxi attended the meeting and gave speeches. 02 Special Director Ye Tianchun, Director of the Institute of Microelectronics, Chinese Academy of Sciences, delivered a video speech. Academician Xu Juyan of the Chinese Academy of Engineering, Zheng Minzheng, member of the National Advisory Committee for Information Technology Experts, Wang Xinchao, chairman of the alliance, and Shi Lei, executive vice chairman of the alliance, attended the meeting. Union Secretary-General Yu Jikang presided over the meeting.

157441111714835529.jpg

The chairman of the alliance, Wang Xinchao, published the keynote report of "Continuation and Innovation and Development". Wang Xinchao pointed out that as the previous manufacturing process no longer further enjoys the cost reduction bonus brought by chip node miniaturization, at the same time, the market's requirements for product function integration are getting higher and higher, which promotes the subsequent SiP, 2.5D, The continuous development of advanced packaging technologies such as 3D, PoP, and fanout. The integrated circuit advanced packaging technology plays an increasingly important role in the process of bringing high-end products to the market, and the value content in the package has also continued to rise. This indirectly aroused the interest of advanced manufacturers in the field of advanced packaging, and began to eat away at packaging. The global foundry giants are too involved in fanout and 2.5D advanced packaging technology products, and have strongly occupied the packaging market, and the market competition in the advanced packaging field has become more incandescent. Against such a highly competitive industry background, the national packaging and testing alliance must further work innovatively, give full play to the role of the alliance's platform, and support and help domestic packaging and testing industry chain companies to develop collaboratively.

Shi Lei, the executive vice chairman of the alliance, announced the commendation of the technology innovation award of the IC packaging and testing industry chain. 19 innovative technological achievements such as high-density system-level SiP packaging technology applied to high-speed and 5G communication RF ICs, 5 individual outstanding contributors such as Shi Lei, and 26 outstanding alliance liaisons including Zhou Jian were commended at the meeting.

The conference also held a summit dialogue and a seminar on the outline of the semiconductor and packaging industry. Cao Liqiang, Executive Deputy Secretary-General of the Packaging and Testing Alliance, presided over the activities of this session.

In order to share the joy of growth with the industry, and promote the exchange and coordinated development of the industry chain, this event starts from a global perspective and combines the characteristics of China's industrial development with a wide range of leaders, well-known experts, and well-known semiconductor companies at home and abroad. Explore the opportunities and challenges of industrial development, and look for market opportunities for deep cooperation.

The National Packaging and Testing Alliance was established in Beijing on December 30, 2009. It is formed by 25 backbone units engaged in the manufacturing, research and development, and academic research of the integrated circuit packaging and testing industry chain. It is a national science and technology The first industrial technology innovation strategic alliance established in a major project. The packaging and testing alliance has grown to 71 members. An expert advisory committee composed of 21 expert professors.

In the past ten years, the National Packaging and Testing Alliance has achieved gratifying results in improving China's integrated circuit packaging and testing technology level, strengthening the coordinated development of the integrated circuit industry chain, and constructing innovative organizations. ".



Editor-in-chief: Chen Bingxin
Related Links

2019 World VR Industry Conference

On October 19, the 2019 World VR Industry Conference, jointly sponsored by the Ministry of Industry and Information Technology and the Jiangxi Provincial People's Government, was grandly opened in Nanchang. At the opening ceremony, Liu He, a member of the Political Bureau of the CPC Central Committee and vice premier of the State Council, delivered an important speech.

The 2nd Global IC Entrepreneurs Conference and the 17th China International Semiconductor Expo

On September 3, the 2nd Global IC Entrepreneurs Conference and the 17th China International Semiconductor Expo were hosted by the Ministry of Industry and Information Technology and the Shanghai Municipal People's Government and hosted by the China Semiconductor Industry Association and China Electronics and Information Industry Development Institute. Opening in Shanghai

2019 World VR Industry Conference Press Conference

On June 20, the Ministry of Industry and Information Technology and the Jiangxi Provincial People's Government jointly held a press conference in Beijing to introduce the situation and preparations for the 2019 World VR Industry Conference.

The 11th Central China Investment and Trade Expo Electronic Information Industry Development Forum

On May 19th, the 11th Central China Investment and Trade Expo Electronic Information Industry Development Forum was held in Nanchang, Jiangxi. Yang Wenbin, deputy mayor of Nanchang Municipal People's Government, and Wang Yibin, deputy director of Jiangxi Provincial Ministry of Industry and Information Technology attended and addressed the event.

2019 World Ultra HD Video Industry Development Conference

On May 9, the 2019 World Ultra HD Video (4K / 8K) Industry Development Conference was held in Guangzhou. The conference was co-sponsored by the Ministry of Industry and Information Technology, the State Administration of Radio and Television, the Central Radio and Television Station, and the People's Government of Guangdong Province. Minister of Industry and Information Technology Miao Wei attended the meeting and delivered a speech.

The 7th China Electronic Information Expo

The theme of this summit is "Innovation Drives Development and Wisdom Empowers the Future". Government industry authorities, well-known experts and scholars and entrepreneurs at home and abroad will be invited to give keynote speeches, delve into new models, new kinetic energy and new paths of industrial innovation and development, and promote electronics. High-quality development of the information industry. ...

The First Global IC Entrepreneurs Conference

On December 11, under the guidance of the Ministry of Industry and Information Technology and the Shanghai Municipal People's Government, hosted by the China Semiconductor Industry Association and China Electronics and Information Industry Development Research Institute, and hosted by Beijing CCID Conference and Exhibition Co., Ltd., China Electronics News Agency, and Shanghai Integrated Circuit Industry Association "The First Global IC Entrepreneurs Conference and the 16th China International ...

2018 World VR Industry Conference

On October 19, the 2018 World VR Industry Conference was grandly opened in Nanchang. At the opening ceremony, Lu Zhanong, vice chairman of the CPPCC National Committee, delivered a congratulatory letter from President Xi Jinping, Minister of Industry and Information Technology Miao Wei, Secretary of the Jiangxi Provincial Party Committee Liu Qi, Jiangxi Provincial Party Committee Standing Committee Member, and Nanchang Municipal Party Committee Secretary Yin Meigen delivered speeches.

The Second China Virtual Reality Innovation and Entrepreneurship Competition Launched ...

On August 20, under the guidance of the Office of the China Innovation and Entrepreneurship Competition Organizing Committee, a press conference on the launch of the second China Virtual Reality Innovation and Entrepreneurship Competition, jointly organized by the Virtual Reality Industry Alliance and Guoke Innovation and Venture Investment Co., Ltd. was held in Beijing.

Press conference on home grid purchase analysis report in the first half of 2018

On August 2nd, the CCID Research Institute of the Ministry of Industry and Information Technology and China Electronics News issued the "Home Network Purchase Analysis Report for the First Half of 2018" (hereinafter referred to as "Home Network Purchase Report") in Beijing. The report shows that in the first half of 2018, the scale of China's B2C grid purchase market (including mobile terminals) reached 264.1 billion yuan ...

2018 Manufacturing “Double Innovation” Summit Forum

On June 22, the 2018 “Double Innovation” Manufacturing Forum was held in Beijing. This forum is hosted by China Electronics and Information Industry Development Institute, China Manufacturing Enterprise Innovation Development Alliance and China Software Industry Association Industrial Internet Branch, China Electronics News Agency, Beijing Yundao Intelligent Manufacturing Technology Co., Ltd. and China Shipbuilding Industry ...

2018 World VR Industry Conference Press Conference

On May 21, the reporter learned from the press conference of the 2018 World VR Industry Conference held in the Great Hall of the People in Beijing that it was co-sponsored by the Ministry of Industry and Information Technology and the People's Government of Jiangxi Province, the China Electronics and Information Industry Development Institute, and the Jiangxi Province Industry And Information Committee, Nanchang Municipal People's Government, Virtual Reality Industry ...

Digital Economy Frontier Forum-CITE2018 The 6th China ...

In order to implement the spirit of the Nineteenth National Congress of the Communist Party of China, fully demonstrate the latest development achievements of the new generation of information technology industry, promote breakthroughs in the core technology of the industry, accelerate the formation of new momentum for the digital economy, and lead the supply-side reform of the information technology industry.The Ministry of Industry and Information Technology, Shenzhen The people's government will have a total of ...

China's home appliance market report released in the first half of 2019

On July 29, the China Electronics and Information Industry Development Institute released the "Report on China's Home Appliance Market in the First Half of 2019" (hereinafter referred to as the "Report") in Beijing. The "Report" shows that from January to June 2019, China's home appliance industry operated steadily and made steady progress, with both production and sales higher than the same period last year. among them,...

A new era of magnificent 70 years of struggle

For 70 years, the Chinese Communists have never stopped the "rush test." On the land of Divine Land, a splendid picture of development is being depicted, and a lot of epic struggles are being written. ...

2019 to create an upgraded version of the "double innovation" manufacturing industry

Focusing on the connotative nature, development trends, and practical implications of the “double innovation” upgrade of the manufacturing industry, leaders of government departments and institutions, academicians and experts from scholars of the two academies, key regions and business leaders are invited to write related articles to discuss the manufacturing industry together "Shuangchuang" new development path. ...

Focus on the National Two Sessions of 2019

March 3rd, the condensed consensus composes the era chapter, and the common country is a picture of revival. The second meeting of the Thirteenth National Committee of the Chinese People's Political Consultative Conference opened in the Great Hall of the People on the afternoon of the 3rd. ...

MWC2019 Mobile World Congress Report

MWC, Mobile World Congress. The organizer, Global Mobile Communications Systems Association (GSMA), was established in 1987 and is one of the three major international organizations in the world of mobile communications. Its members now include nearly 800 mobile operators from 220 countries and more than 230 countries. Extensive mobile ...

CEN Video News | 2019 CITE Senior Vice President, Renesas Electronics

At the 7th Electronic Information Expo, Toshiba Makoto, senior vice president of Renesas Electronics, was interviewed by a reporter from China Electronics News. ...

Video news 丨 Academician experts talk about intelligent connected cars

On March 19, on the eve of the Shanghai Electronics Fair in Munich, the Forum on Innovation and Development of New Energy and Intelligent Connected Cars was held in Shanghai. The forum invited more than 30 industry professionals at home and abroad and nearly 35 wonderful speeches. Large field exhibition ...

Interview with the two conferences 丨 Wang Jing, member of the CPPCC National Committee and president of Newland Technology Group

During the National "Two Sessions" in 2019, Wang Jing, a member of the National Committee of the Chinese People's Political Consultative Conference and president of Newland Group, said in an interview with the reporter of "China Electronics News": Traditional rural areas need to play the role of the carrier and engine of information technology and the Internet to promote agricultural production, ...

Links
About Us | Contact Us | Advertising Services
Electronic Information Industry Network Logo

a 在线久久2019