Forum on Integrated Innovation and Development of Integrated Circuits Advanced Packaging Industry Chain Held
On November 22, 2019, the National Integrated Circuits Packaging and Testing Industry Chain Technology Innovation Strategic Alliance held the "Integrated Circuits Integrated Packaging Industry Chain Collaborative Innovation Development Forum" at the Pullman Hotel in Wuxi New Lake to celebrate the national integrated circuit packaging and testing industry chain technology innovation The tenth anniversary of the establishment of the strategic alliance. Qiu Gang, deputy inspector of the Ministry of Science and Technology's Major Special Projects Division, deputy director of the 02 Major Project Implementation Management Office, deputy director of the National Integrated Circuit Industry Development Advisory Committee, leader of the National Science and Technology Major Supervision and Evaluation Team in the field of electronic information, and former director of the Foreign Experts Bureau Ma Junru Li Xinnan, Secretary General of the Liaison Group of the National Ministry of Science and Technology, Chairman of the Industrial Technology Innovation Strategic Alliance Cooperative Development Network, Director of the 02 Special Office, Deputy Director of the Shanghai Science and Technology Commission, Gan Frequency, and Deputy Mayor Zhu Aixun of Wuxi attended the meeting and gave speeches. 02 Special Director Ye Tianchun, Director of the Institute of Microelectronics, Chinese Academy of Sciences, delivered a video speech. Academician Xu Juyan of the Chinese Academy of Engineering, Zheng Minzheng, member of the National Advisory Committee for Information Technology Experts, Wang Xinchao, chairman of the alliance, and Shi Lei, executive vice chairman of the alliance, attended the meeting. Union Secretary-General Yu Jikang presided over the meeting.
The chairman of the alliance, Wang Xinchao, published the keynote report of "Continuation and Innovation and Development". Wang Xinchao pointed out that as the previous manufacturing process no longer further enjoys the cost reduction bonus brought by chip node miniaturization, at the same time, the market's requirements for product function integration are getting higher and higher, which promotes the subsequent SiP, 2.5D, The continuous development of advanced packaging technologies such as 3D, PoP, and fanout. The integrated circuit advanced packaging technology plays an increasingly important role in the process of bringing high-end products to the market, and the value content in the package has also continued to rise. This indirectly aroused the interest of advanced manufacturers in the field of advanced packaging, and began to eat away at packaging. The global foundry giants are too involved in fanout and 2.5D advanced packaging technology products, and have strongly occupied the packaging market, and the market competition in the advanced packaging field has become more incandescent. Against such a highly competitive industry background, the national packaging and testing alliance must further work innovatively, give full play to the role of the alliance's platform, and support and help domestic packaging and testing industry chain companies to develop collaboratively.
Shi Lei, the executive vice chairman of the alliance, announced the commendation of the technology innovation award of the IC packaging and testing industry chain. 19 innovative technological achievements such as high-density system-level SiP packaging technology applied to high-speed and 5G communication RF ICs, 5 individual outstanding contributors such as Shi Lei, and 26 outstanding alliance liaisons including Zhou Jian were commended at the meeting.
The conference also held a summit dialogue and a seminar on the outline of the semiconductor and packaging industry. Cao Liqiang, Executive Deputy Secretary-General of the Packaging and Testing Alliance, presided over the activities of this session.
In order to share the joy of growth with the industry, and promote the exchange and coordinated development of the industry chain, this event starts from a global perspective and combines the characteristics of China's industrial development with a wide range of leaders, well-known experts, and well-known semiconductor companies at home and abroad. Explore the opportunities and challenges of industrial development, and look for market opportunities for deep cooperation.
The National Packaging and Testing Alliance was established in Beijing on December 30, 2009. It is formed by 25 backbone units engaged in the manufacturing, research and development, and academic research of the integrated circuit packaging and testing industry chain. It is a national science and technology The first industrial technology innovation strategic alliance established in a major project. The packaging and testing alliance has grown to 71 members. An expert advisory committee composed of 21 expert professors.
In the past ten years, the National Packaging and Testing Alliance has achieved gratifying results in improving China's integrated circuit packaging and testing technology level, strengthening the coordinated development of the integrated circuit industry chain, and constructing innovative organizations. ".
Editor-in-chief: Chen Bingxin